Siemens Digital Industries Software announced today, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using ...

The funding was led by Eclipse, with participation from Maverick Capital, Fundomo, EPIQ Capital Group, LLC, and legendary CPU ...

ZeroPoint Technologies AB today announced a breakthrough hardware-accelerated memory optimization product that enables the ...

Active Participant in RISC-V academic projects worldwide and the RISC-V International Certification Steering Committee ...

San Jose, CA – February 21, 2025 - Veriest Solutions, a leading provider of engineering services and solutions, announces its strategic participation in DVCon US 2025 as part of its expanding presence ...

A system on chip (SoC) is exactly as its name suggests, an entire system on a single silicon chip. This chip or integrated ...

Logic Fruit Technologies is excited to announce its participation in Embedded World Europe 2025, taking place from March 11th ...

S2C has collaborated with Arm, Xylon, and ZC Technology to develop an innovative hybrid prototyping solution tailored for future automotive central and zonal E/E architectures. This innovative design ...

Using Quobly’s Strategy to Build Qubits With FD-SOI Technology, Readout Architecture ‘Provides a Path to Low Power and Scalable Quantum’ ICs ...

YorChip, Inc. in collaboration with its design partner SiliconIPs announces development of a 50nS latency 100G Ultra Ethernet ...

SiliconIPs announces development of a 50nS latency 100G Ultra Ethernet ready Mac/PCS IP core. The IP is optimized for size, ...

The rise of optimized reasoning models, capable of matching the performance of massive solutions like ChatGPT, strengthens ...