How to build an efficient and flexible multi-die system for edge AI.
D-IC thermal management & KGD strategies; system-level engineering; within-wafer variability; image segmentation.
Foundry-Enabled Patterning of Diamond Quantum Microchiplets for Scalable Quantum Photonics” was published by researchers at ...
Researchers from Ulsan National Institute of Science and Technology (UNIST) designed a biodegradable, energy efficient artificial synapse that uses a layered structure made from naturally-derived ...
Triggered Backdoors” was published by researchers at Berlin Institute for the Foundations of Learning and Data (BIFOLD), TU ...
Multi-die assemblies are the next phase of Moore’s Law, scaling up and out to improve performance and add flexibility into ...
Tightly coordinated data movement and low-latency on-chip storage for real-time environments.
Researchers at UCSD and Columbia University published “ChipBench: A Next-Step Benchmark for Evaluating LLM Performance in AI-Aided Chip Design.” Abstract “While Large Language Models (LLMs) show ...
Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...
Impact Of The Film Transfer And Grain Size On The Cu-barrier Properties Of 2D WS2 Films (NUS et al.)
A new technical paper titled “Enhancing Cu-barrier properties of 2D-WS2 barriers: The role of grain size and surface passivation” was published by researchers at National University of Singapore, ...
A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...
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