Pinpointing failures, ensuring known-good optical engines, and controlling test costs become increasingly critical as photonics moves into advanced packages.
Researchers at Chinese Academy of Sciences, Jilin University, State Key Laboratory of Advanced Manufacturing for Optical ...
Researchers at KU Leuven, Kunsan National University, Vrije Universiteit Brussel, imec, et al. published “Irradiation-Source-Dependent Tone Conversion in Dry-Deposited Halogenated Amorphous Zeolitic ...
Researchers from Institute of Science Tokyo, Yokohama National University, AIST, and Photonics Electronics Technology Research Association (PETRA) published a technical paper titled “Reduced-DSP ...
Researchers at Arizona State University and University of Maryland published “SEAL: Multitenant Security-Aware Layer Mapping for Heterogeneous 3-D CiM Accelerators.” Abstract: “Heterogeneous 3-D ...
Based Transistor Modeling for Ultra-Fast SPICE Simulation and Standard Cell Library Characterization.” Abstract: “Neural network (NN)-based transistor models have proven to be a promising solution to ...
Why better models, richer metrology, explainable AI, and cross-industry collaboration must come together to extend semiconductor scaling.
Two devices operating at exactly the same voltage, frequency, and temperature can behave differently depending on what they ...
The semiconductor industry reached $1 trillion years early, but keeping pace with demand now depends on systems integration as much as transistor scaling. Packaging, photonics, power, and test are ...
Because foundries are oversubscribed, OSATs are also fully utilized, which favors ROI. “The sector is constrained by ...
Moving advanced packaging from wafer to panel sounds, at first, like a geometry problem. Large AI and HPC packages are increasingly rectangular, while the 300mm wafer underneath them is still round.
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