An Agentic Approach for SoC Security Verification using Large Language Models” was published by researchers at University of ...

Evolving lithography demands are challenging mask writing technology, and the shift to curvilinear is happening.

Creating high-quality and high-performance autonomous and connected vehicles while mitigating safety risks across their ...

D-IC trends and challenges; virtual prototypes for SDVs; chiplet security; sustainable AI development; quality best practices ...

A new technical paper titled “Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes” was published by ...

A new technical paper titled “Practical Guidance on Selecting Analytical Methods for PFAS in Semiconductor Manufacturing ...

Researchers from the University of Massachusetts Amherst created silicon-based in-sensor visual processing arrays that can ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

A new technical paper titled “Integrated phononic waveguide on thin-film lithium niobate on diamond” was published by ...

Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...

While line dimensions are large by die standards, they’re small by PCB standards. “The minimum solution is a 2µm line width ...

Wafer-scale AI accelerators vs. single chip GPUs; machine intelligence on wireless edge networks; topological flat-band-driven metallic thermoelectricity; all-in-one analog AI HW; centralized HPC ...