Glass substrates offer mechanical, electrical, and chemical advantages for AI and HPC chips Industrywide adoption first requires resolving manufacturing and standardization issues Lam is helping scale ...

As memory technologies continue to scale, manufacturing processes are becoming increasingly complex. Additional process steps, tighter process windows, and new sources of variation are making it ...

AI computing is driving demand for advanced packaging and 3D integration. Lam and imec are expanding joint R&D to accelerate manufacturing readiness. The collaboration now includes Aether® dry resist ...

Lam Research Corporation (the "Company," "Lam," "Lam Research") today announced financial results for the quarter ended September 27, 2026 (the "September 2026 quarter"). Highlights for ...

To access the webcast, visit the Investors section of Lam's website at http://www.lamresearch.com and click on the Investors/Investors Overview/Events & Presentations ...

Lam Research has opened its largest U.S. warehouse, a 470,000-square-foot logistics hub designed to strengthen the semiconductor supply chain and support demand for AI-enabled technologies. Located in ...

AI is increasing demand for larger and more complex chip packages. Traditional wafer-based packaging faces scaling challenges for large-format designs. Panel-level processing may improve manufacturing ...

Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's equipment and services allow customers to build smaller and ...

State-of-the-art, Silicon Forest facility to support collaborative innovation with chip makers; first milestone in more than $3B planned expansion of global lab network President and Chief Executive ...