A technical paper titled “Test Generation for Subcircuits with High Functional Switching Activities” was published by Irith Pomeranz at Purdue University. Abstract “Chip aging results in defects that ...

This paper details how AnalogPort, a leading high-speed interconnect solutions provider, successfully addressed these limitations using Siemens EDA’s Symphony Pro (part of Solido Simulation Suite) for ...

AI chip for SDVs; hypercar; automotive edge chip; Waymo's new GenAI model; neuromorphic detects motion 4X faster; sodium-ion battery; Ferrari-all electric; carmakers' recalibrations on EVs; batteries ...

Specification quality is another key challenge. Formal verification depends on clear intent, yet specifications are often incomplete, ambiguous, or difficult to operationalize. AI can help extract ...

A new technical paper titled “High-clockrate free-space optical in-memory computing” was published by researchers at UC Berkeley, USC,  and TU Berlin. Abstract “The ability to process and act on data ...

This integration addresses the fundamental barriers that have historically limited formal verification adoption: complexity ...

As demand for data center compute accelerates, power efficiency has become the defining metric for modern CPUs, GPUs, and AI ...

How much of the energy consumed in an AI chip is spent doing something useful? This question affects everything from software ...

A new technical paper titled “Ultrafast visual perception beyond human capabilities enabled by motion analysis using synaptic ...

Reliability is now a system-level concern that includes everything from materials and packaging to testing with backside power.

Version 3.0 of the interconnect standard doubles bandwidth and supports new use cases and enhanced manageability.

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...