Programmatic control, AI integration, and automated workflows for high-frequency design.
Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The ...
Hardware-based security; 3D-IC challenges, opportunities; resource-constrained graphics; silicon photonics; edge AI speech ...
With the advancement in AI networks and low-power inference devices, such as DSPs and NPUs, the time is right for voice-based user interfaces.
Researchers from Politecnico di Milano, Peking University, and Hewlett Packard Labs developed a Closed-Loop In-Memory ...
Band Power Side-Channel Detection for Semiconductor Supply Chain Integrity at Scale” was published by researchers at Cornell ...
Evolving challenges and strategies in AI/ML model deployment and hardware optimization have a big impact on NPU architectures ...
A new technical titled “Impact of Random Phase Distribution on Ferroelectric Tunnel Field-Effect Transistors With Mitigation Strategies for Compute-in-Memory Applications” was published by researchers ...
A new technical paper titled “A Case for Hypergraphs to Model and Map SNNs on Neuromorphic Hardware” was published by ...
A new technical paper titled “Oxide Semiconductor for Advanced Memory Architectures: Atomic Layer Deposition, Key Requirement ...
Russell Klein, program director for Siemens EDA’s High-Level Synthesis Division, talks with Semiconductor Engineering about ...
Efficient SLM Edge Inference via Outlier-Aware Quantization and Emergent Memories Co-Design” was published by researchers at ...
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