AI computing is driving demand for advanced packaging and 3D integration. Lam and imec are expanding joint R&D to accelerate manufacturing readiness. The collaboration now includes Aether® dry resist ...

Virtual twins and machine learning (ML) offer a faster, lower-cost way to identify systemic yield issues as DRAM manufacturing grows more complex.

Glass substrates offer mechanical, electrical, and chemical advantages for AI and HPC chips Industrywide adoption first requires resolving manufacturing and standardization issues Lam is helping scale ...