Rising IT densities and AI workloads demand smarter heat management and equipment placement. This paper “Application of ...

How silicon technologies are evolving to meet the unprecedented computational demands of AI, while addressing critical ...

Aware Tier Partitioning for 3D IC Placement with ILP Formulation” was published by researchers at Seoul National University ...

Where to start? Failure analysis is a systematic process that uses electrical characterization, physical analysis, and ...

As Edge GenAI necessitates specialized, highly efficient hardware solutions, these demands are generating growth opportunities and driving demand across the chip industry ecosystem.

Commonly used outlier detection approaches, such as parts average testing or determining whether a die is good based upon other dies in the immediate neighborhood, are falling short in advanced ...

Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

As chips move to ever-finer geometries, the active region (diffusion) shapes of neighboring cells can impact timing analysis and power calculations for the entire design. The LLE (Local Layout Effect) ...

An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs” was published by researchers at University of Michigan, Shanghai Jiao Tong University and ...

Multi-layer high-K metal gate (HKMG) film stacks require the adoption of a feedforward process.

Advantest offers a full lineup of test solutions for AI-capable chips that perform high-quality, cost-effective tests at high ...

Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.