Video system design goes beyond evaluating and using the right microprocessors, peripheral chips and other related components. Consider that high-pin count, fine-pitch BGAs ranging upwards of 1,052 ...
Etters, Pa. — Continuing to increase the versatility of its high-speed AirMax VS connector system, FCI currently has a new ball grid array (BGA) version in development that will incorporate a BGA ...
Claiming to be able to find the faults missed by X-ray inspection systems, the 3D-Bga inspection system detects hard-to-find faults such as the presence of flux, micro cracks, and cold solder joints.
The company’s latest system incorporating the Focused Infra-Red (FIR) rework system technology replaces its Lightmaster model. Hands free and semi-automatic, the IR-X400 FIR rework system boasts the ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results