Rebecca Oesterle saw the packaging industry growth first hand as one of Energizer’s earliest supply chain managers. Over her career, she led many changes in packaging—an industry that would become ...

The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

The MarketWatch News Department was not involved in the creation of this content. Enosemi Inc. ("Enosemi") and Jabil Inc. (NYSE: JBL) today announced a collaboration in advanced packaging process ...

Four firms collaborate on foaming technology that incorporates recycled content while maintaining performance in multiple ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

Machine Design will have staff on site at Pack Expo Las Vegas 2025 to explore the trends and applied technologies that are propelling innovation in the packaging industry in 2025. The comprehensive ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

The funding will upgrade processing and packaging technology, boosting halal-certified output and improving food safety and ...

"Aero Packaging procures die-cutting machine for corrugated cartons" was originally created and published by Packaging ...

Semiconductors are the critical component that enables our digital life. Their development has come a long way; In 1971, the Intel 4004, which was the first single-chip processor, had just 2,250 ...