In microsystems, metallic components are increasingly replaced by components made of inexpensive polymers. As polymers yield when they are subjected to pressure, the layer thicknesses cannot be ...

Modern integrated circuits are made by depositing layers of different materials upon substrates and then etching circuits within those films. The thickness of the films must be precisely controlled in ...

This article by ADMET discusses foam tensile strength testing. A foam tensile strength test can be found in ASTM D3574 Test E which applies to slab, bonded, and molded flexible cellular urethane foams ...

How graphene-infused foam has been evaluated as a tunable thermal resistor for passive adjustable cooling. The modeling that was done to investigate the concept. The two test fixtures used to measure ...