TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates. The new line will come online in January and is designed to support high ...
Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers December 17, 2025 - ...
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LG Innotek’s ‘Dream Factory’ revolutionizes chip substrate production with AI, robotics
LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These ...
A high-speed parallel bus, such as a double data rate (DDR) memory interface, requires a different approach because the speeds are lower but the number of signals involved is much larger. The design ...
Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive semiconductor ...
With Moon Hyuk-soo, CEO of LG Innotek, promoted to president in the 2026 regular executive reshuffle, LG Innotek is still struggling to bear fruit in new businesses. Unlike Samsung Electro-Mechanics, ...
The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11 billion in 2024 and ...
The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...
Fullerton, Calif. — Designed for the termination of high-speed applications, TT electronics BI Technologies Electronic Components Division's RoHS-compliant SCSI termination resistor network is aimed ...
Semiconductor glass substrates are drawing attention as a key material that can solve problems in the packaging domain, which has hit technical limits in the age of artificial intelligence (AI). Major ...
A BGA-packaged optocoupler from Fairchild Semiconductor offers the smallest form factor for a safety-rated device of this type A BGA-packaged optocoupler from Fairchild Semiconductor offers the ...
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