Electro Magnetic Applications, Inc. (EMA) and Ansys are collaborating to deliver an enhanced design-to-validation workflow to assess and manage risks associated to material charging in space plasma ...

H3C Semiconductor designers used Ansys' comprehensive multiphysics platform — including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC — to engineer a state-of-the-art network processor chip featuring ...

H3C Semiconductor leveraged Ansys Inc (NASDAQ: ANSS) simulation solutions is set to roll out ENGIANT 660 network processor chip that permitted routing, AI, 5G backhaul, and cybersecurity applications.

Under a cooperative research and development agreement, Ansys and L3Harris Technologies are working with the U.S. Army Combat Capabilities Development Command (CCDC) Aviation & Missile Center (AvMC) ...

PITTSBURGH, June 11, 2020 /PRNewswire/ -- Electro Magnetic Applications, Inc. (EMA) and Ansys (NASDAQ: ANSS) are partnering to deliver an enhanced design-to-validation workflow for certifying cable ...

GUC engineers are using Ansys HFSS 3D Layout’s advanced simulation workflow to speed advanced integrated circuit (Advanced-IC) design The workflow helps GUC rapidly incorporate its die-to-die solution ...

Two of the engineering software market’s largest players are set to join forces in a $35 billion cash-and-stock deal. Synopsys Inc., which makes chip design software, today announced that it will pay ...

New AI capabilities and simulation technologies deliver insight-driven innovation across every dimension of product design and development Open workflows enhance collaboration and increase ...

H3C Semiconductor designers used Ansys’ comprehensive multiphysics platform – including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC – to engineer a state-of-the-art network processor chip featuring ...

H3C Semiconductor designers used Ansys’ comprehensive multiphysics platform – including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC – to engineer a state-of-the-art network processor chip featuring ...